The equipment is designed to etch Si plates in manufacture of semiconductors. It is designed as a stand-alone chemical box. The etching is done by means of chemicals based on hydrofluoric acid. All materials used are chemically resistant and they meet the requirements...
research and development
Saw for Cutting the Bones
The equipment is intended for medical purpose and for use in environments with high hygiene requirements. The equipment is made of polished stainless steel; dimensions: 250 x 350 mm, height – 250 mm. (The equipment is used by Czech customer in Czech Republic.)
Chemical line for etching silicon wafers
The equipment is used for an automatic process of etching and cleaning small Si-wafers for research tasks in various process chemicals. The operator will prepare loads of etching baths and will place the baskets with silicon substrates sized 2" in positions for...