The machine is designed for etching of the edges of the silicon wafers and following proceses of rinsing and drying. Etching and rinsing is done by jets with optional position and angle to the wafer. After manual insertion the wafers are automatically centered on the working desk and vacuum clamped. Etching, rinsing and drying run automatically according to one of the preset recipes. Each recipe contains timing of every part of the process, speed of the vacuum desk and duration of speeding up and slowing down. The machine is automatically supplied by etching solution from central supply.
(The equipment is used by Swiss customer in Czech Republic.)