The equipment is a chemical box to clean and etch monocrystal silicon wafers in the chemical SC-1 and in hydrofluoric acid. The operator places baskets with silicon wafers of diameter equal to 4 up to 8“ into individual tubs. Having the required etching time been achieved, the wafers are manually reloaded into rinse tubs and subsequently dried in a dryer. The equipment is designed for manual operation, the control system only controls parameters of individual baths and those of the dryer
(The machine is used in Denmark by a Danish customer)