The equipment is used for an automatic process of etching and cleaning small Si-wafers for research tasks in various process chemicals. The operator will prepare loads of etching baths and will place the baskets with silicon substrates sized 2″ in positions for collection.
Having the automatic process been triggered, the wafers are gradually dipped in etching baths and in rinse baths and they can be dried in a hot-air circulation dryer at the end of the technological process. Handling in the working area of the line is ensured by a built-in portal manipulator.
(The machine is used in Czech Republic by a Czech customer.)